Need serious hot air power for professional BGA and SMD rework? The SUGON 8650Pro delivers 1300W of heating capability with temperature curve modes that match your component requirements. This isn’t a hobby station—it’s built for repair shops tackling laptop GPUs, gaming console APUs, and industrial board-level work.
Three temperature rise profiles let you choose gentle ramping for sensitive components or rapid heating when thermal mass demands it. The SMD Welding Curve Mode provides precise temperature control throughout the reflow process, reducing thermal shock and improving success rates on challenging rework.
At a Glance
| Performance | Convenience |
|---|---|
| 1300W power output | 4 memory preset channels |
| 100°C – 550°C temperature range | 3 temperature rise models |
| Air volume Grade 1–200 | SMD Welding Curve Mode |
| Rapid heating capability | Cool air function |
| Low noise operation | Auto-sleep function |
✓ Dual handle holders ✓ 2 rows of nozzle storage ✓ Adjustable handle bracket ✓ Temperature calibration ✓ °C/°F conversion ✓ Universal voltage (110V/220V)
1300W Professional Power
Budget hot air stations struggle with large packages and heavy ground planes. The SUGON 8650Pro delivers 1300W—enough thermal power for the most demanding rework.
| Challenge | 8650Pro Response |
|---|---|
| Large BGA packages | Sustained high-volume airflow |
| Laptop GPU reflow | Rapid heating to profile temperature |
| Console APU rework | Consistent heat across large dies |
| Lead-free temperatures | 550°C maximum with power to spare |
| Multiple reflow cycles | No thermal fatigue, consistent performance |
When standard 700-800W stations can’t maintain temperature on large chips, the 8650Pro keeps delivering.
SMD Welding Curve Mode
Professional BGA rework demands controlled temperature profiles—not just “set and blast.” The SMD Welding Curve Mode provides precise temperature management throughout the reflow process.
What curve mode delivers:
→ Controlled temperature ramping → Proper preheat phases → Consistent peak temperature → Reduced thermal shock to components → Higher success rates on sensitive packages
Set your profile, let the station manage the curve. Focus on positioning and technique while the 8650Pro handles thermal management.
Three Temperature Rise Models
Different components need different heating approaches. The 8650Pro offers three distinct temperature rise profiles:
| Mode | Heating Speed | Best For |
|---|---|---|
| Gentle | Slow, controlled ramp | Sensitive components, multi-layer boards, BGA with underfill |
| General | Balanced heating | Standard SMD rework, everyday use |
| Rapid | Fast temperature rise | Large thermal mass, quick component removal |
Gentle mode protects sensitive packages and boards with complex layer structures. The slow ramp reduces thermal stress and warping.
General mode balances speed and safety for typical rework tasks. Your everyday setting for standard SMD work.
Rapid mode delivers maximum heating speed when you need to overcome large thermal mass or remove components quickly.
Select the mode that matches your task. The station adapts its heating behaviour accordingly.
Extended Temperature Range
The 100°C to 550°C range covers every hot air application:
| Temperature Range | Applications |
|---|---|
| 100°C – 150°C | Heat shrink, adhesive softening, preheating |
| 200°C – 300°C | Low-temp solder, component preheating |
| 300°C – 380°C | Leaded solder reflow, general SMD |
| 380°C – 450°C | Lead-free solder, BGA rework |
| 450°C – 550°C | Stubborn packages, high-temp applications |
The 550°C maximum handles even the most demanding lead-free profiles with headroom to spare.
Adjustable Air Volume
Air volume control from Grade 1 to 200 provides precise airflow management:
Low airflow (Grade 1-50): → Fine-pitch SMD components → 0402/0603 parts that could shift → Concentrated heat application → Delicate rework near sensitive areas
Medium airflow (Grade 50-120): → Standard BGA packages → General SMD rework → Balanced heat distribution → Everyday use settings
High airflow (Grade 120-200): → Large BGA packages (GPU, APU) → Shield can removal → Maximum thermal transfer → Rapid component removal
Match airflow to your component size. Protect tiny parts while still moving serious heat when needed.
Cool Air Function
Switch to cool air for controlled cooling after reflow:
→ Speed up post-reflow cooling → Set solder joints before movement → Prevent thermal shock from rapid cooling → Control the entire thermal cycle
Proper cooling matters for reliable joints. The cool air function gives you control over the complete rework process.
Four Memory Presets
Store your most-used temperature and airflow combinations:
| Preset | Example Setup | Application |
|---|---|---|
| 1 | 320°C / Grade 80 | Leaded SMD rework |
| 2 | 380°C / Grade 100 | Standard lead-free BGA |
| 3 | 420°C / Grade 150 | Large BGA packages |
| 4 | 250°C / Grade 60 | Preheating, sensitive work |
Recall any preset instantly. No manual adjustment when switching between common tasks.
Low Noise Operation
High-power hot air stations often mean high noise. The SUGON 8650Pro delivers 1300W performance with minimised acoustic output.
Benefits of quiet operation:
→ Less fatigue during long sessions → Better concentration on precision work → Comfortable workshop environment → Hear audio cues during rework
Professional power without the industrial noise.
Dual Handle Holders
Two handle positions for flexible workflow:
→ Position handles at different angles → Quick access during multi-stage work → Safe storage for hot handles → Organised workspace
Work the way you prefer. The dual holders adapt to your bench layout.
Nozzle Storage System
Two rows of nozzle storage keep your accessories organised and accessible:
→ Hot nozzles stored safely during swaps → Full nozzle set within reach → Quick identification of sizes → Professional workspace organisation
No hunting for nozzles. No burning yourself on hot accessories. Everything in its place.
Adjustable Handle Bracket
The reinforced adjustable bracket positions your handle exactly where you need it:
→ Multiple angle positions → Sturdy construction → Stays where you set it → Durable for long-term use
Find your optimal working position and lock it in.
Auto-Sleep Function
Set the handle down and the station enters sleep mode automatically:
→ Reduced temperature during idle → Extended heating element life → Energy savings → Quick wake-up when you resume
Protection without interruption. The station watches for idle time so you don’t have to.
What You Can Rework
Laptop Motherboards GPU reflow, BGA replacement, chip removal and reballing. The 1300W power handles laptop-sized packages without temperature sag.
Gaming Consoles PlayStation and Xbox APU rework. HDMI port replacement. Southbridge reflow. Large die packages need large power—the 8650Pro delivers.
Graphics Cards Desktop GPU reflow and replacement. Memory chip rework. The temperature curve mode manages proper profiles for large packages.
Phone and Tablet Boards IC removal and replacement. Shield can lifting. Connector replacement. Dial down power for precision work on mobile devices.
Industrial Control Boards Large connector removal. Multi-chip rework. The extended temperature range handles industrial components.
Server and Networking Equipment BGA replacement on server boards. Network processor rework. Professional-grade power for professional-grade equipment.
Additional Features
Temperature Calibration Maintain accuracy over time with built-in calibration function.
°C/°F Conversion Switch display units to match your preference.
Buzzer Control Enable or disable audio feedback.
Universal Voltage 110V/220V compatibility for worldwide use.
Technical Specifications
| Specification | Value |
|---|---|
| Model | SUGON 8650Pro |
| Power Output | 1300W |
| Input Voltage | AC 110V / AC 220V (Universal) |
| Temperature Range | 100°C – 550°C |
| Air Volume | Grade 1 – 200 |
| Temperature Rise Modes | 3 (Gentle / General / Rapid) |
| Memory Presets | 4 channels |
| Special Modes | SMD Welding Curve Mode, Cool Air |
| Handle Holders | 2 |
| Nozzle Storage | 2 rows |
| Auto-Sleep | Yes |
| Noise Level | Low noise operation |
What’s in the Box
| Quantity | Item |
|---|---|
| 1x | SUGON 8650Pro base station |
| 1x | Hot air gun with handle |
| 2x | Handle holders |
| 1x | Nozzle set (assorted sizes) |
| 1x | Adjustable handle bracket |
| 1x | Power cable |
| 1x | User manual |
Ideal For
| User | Why 8650Pro Works |
|---|---|
| Laptop repair shops | 1300W handles GPU/APU rework |
| Console repair techs | Power for large die packages |
| BGA specialists | Curve mode for proper profiles |
| Professional workshops | Serious tool for serious work |
| High-volume repair | Reliable daily driver |
What Makers Are Saying
“Finally a hot air station with enough power for laptop GPU work. My old 850W station couldn’t maintain temperature on large packages—the 8650Pro doesn’t even flinch. The curve mode makes BGA rework so much more consistent.”
“The three heating modes are perfect. Gentle for sensitive phone boards, rapid for pulling shield cans off consoles. Having real power when you need it changes what jobs you can take on.”
